SCHOOL OF CHEMICAL ENGINEERING

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教授

王 为

现任职称/职务:教授/系主任/ 博士生导师
通讯地址:天津市天津大学化工学院应用化学系
电子邮箱:wwangg@tju.edu.cn
办公电话:022-27403389

论著专利:

一、获得授权的美国发明专利

HIGH-POWER ALUMINUM-AIR BATTERY SYSTEM

专利号:US 9705166

二、获得授权的中国发明专利主要有:

1)由一维纳米线阵列结构温差电材料制造的微温差电池(专利号:ZL01140414.0

2)液相电沉积N-型及P-型一维纳米线阵列温差电材料及设备和制造方法(专利号:ZL02125377.3

3)一维纳米线阵列材料温差电性能测试系统(专利号:ZL02125378.1

4)电化学铝—水储氢、制氢的方法及设备(专利号:ZL02148850.9

5)燃料电池的结构和制备方法(ZL 200510013287.2

6)微型温差电池及其制造方法(ZL03130568.7

7)脉冲镀镍基纳米复合镀层的方法及设备(ZL200410018745.7

8) 微型薄膜温差电池的结构及其制造方法(ZL200410072381.0

9)一种微型电池组的结构及制造方法(专利号:200710057067.9

10)由薄膜温差电材料制造的单层温差电器件和集成化微型温差电器件(专利号:ZL200710057345.0

11)基于薄膜温差电材料的微型温差电器件组装系统及方法(专利号:200810153632.6

12)薄膜温差电材料电阻率测试系统及方法(专利号:200810153570.9

13)电沉积Bi2Te3掺杂薄膜温差电材料的制备方法(专利号:200910069904.9

14))薄膜温差电材料赛贝克系数测试系统及方法(专利申请号:200810153534.2

15) 一种微型温差电池结构的优化方法(专利号:201110428427.8

16) 微型温差电池热电转换效率测试系统及方法(专利申请号:201210024829.6

17)薄膜热电材料热导率测试系统及方法(专利号:201210039803.9

18) 用铝-水制氢/储氢的装置及其液流方式(专利号:201210102861.1

19)由薄膜温差电材料制造的叠层结构微型温差电器件及制造方法(专利号:201210006868.3

20)一种实现电解液水平流动及流速可控的电解池系统(专利号:ZL201510158296.4)

21)一种氯化银纳米粉体的合成方法(专利号:ZL201810774915.6




三、发表的代表性论文主要有:


[1] Analysis on the secondary active site of FeN4-graphene for oxygen reduction reaction by DFT calculation. Chemical Physics Letters, 2021, 765: 138321-138327

[2] Morphology and Structure Controls of Single-Atom Fe–N–C Catalysts Synthesized Using FePc Powders as the Precursor. Processes, 2021, (9):109-122 

[3] A Simple Synthesis Method of Single-Size AgCl Nano-Particles and Its Discharge Behavior. Journal of The Electrochemical Society, 2020, 167: 130538-130548 

[4] High-Performance Mg–Al–Bi Alloy Anode for Seawater Batteries and Related Mechanisms. Processes, 2020, ( 8): 1362-1379

[5] Reconstructing 1D Fe Single-atom Catalytic Structure on 2D Graphene Film for High-Efficiency Oxygen Reduction Reaction. ChemSusChem, 2020, 13, 1-11

[6] Systematic exploration of N, C configurational effects on the ORR performance of Fe–N doped graphene catalysts based on DFT calculations. RSC Advances, 2019, 9, 22656-22667 

[7] Systematic exploration of N,C coordination effects on the ORR performance of Mn–Nx doped graphene catalysts based on DFT calculations. Phys. Chem. Chem. Phys., 2019, 21, 12826-12836

[8] Electrochemical Redaction of Bi(Ⅲ)/Sb(Ⅲ)/Te(Ⅳ) with EDTA and Tartaric Acid in Sulfuric Solution. Journal of The Electrochemical Society, 2019, 166(14):D719-D725


[9]Investigations on the Potential Fluctuation of Al-Sn Alloys during Galvanostatic Discharge Process in Alkaline Solution. Journal of The Electrochemical Society, 165 (7) A1492-A1502 (2018)

[10]Improvement of O2 adsorption for α-Mn02 as an oxygen reduction catalyst by Zr4+ doping. RSC Adv., 2018, (8): 2963-2970

[11]Electrochemical Properties of Al-based Solid Solutions Alloyed by Element Mg, Ga, Zn and Mn under the Guide of First Principles. Fuel Cells, 2017, 17(5):723-729

[12] Fabrications of Polyaniline Films by Pulse Electrodeposition in Acidic Solutions with Different Anions and Their Thermoelectric Performances. JOURNAL OF ELECTRONIC MATERIALS, 2017, 46(8):4815-4824

[13]Investigations on the Electrochemical Reduction Behaviors of Cu-Se Compound in Sulfuric Acid Solutions. JOURNAL OF ELECTRONIC MATERIALS, 2017, 46(5): 3187-3199

[14]Electrode Materials on the Electropolymerization Process of Aniline in Nitri.cAcid Media. JOURNAL OF ELECTRONIC MATERIALS, 2017,46(2): 1324-1330

[15]Electrodeposition and Thermoelectric Properties of Cu-Se Binary Compound Films[J]. Journal of Electronic Materials, 2016, 45(3):1974-1981

[16]Pulse Electropolymerization and Thermoelectrical Performances of Carbon Nanotubes/Polyaniline Composite Film, ECS J. Solid State Sc., 2016, 5(5), M27-M30

[17] Electrochemical Reduction Process of BiIII, TeIV and SbIII with Complexing Agent in Hydrochloric Acid Bath, J. Electrochem. Soc., 2015, 162(6): D229-D235

[18]Preparation of Bi2Te3/Nano-SiC Composite Thermoelectric Films by Electrodeposition.JOURNAL OF ELECTRONIC MATERIALS, 2015, 44(6):2166-2171

[19]Effect of SiC Nanoparticles on the Electrochemical Reduction Behaviors of Ionic Bismuth and Tellurium.JOURNAL OF ELECTRONIC MATERIALS, 2015, 44: 1777-1784

[20]A High Packing Density Micro-thermoelectric Power Generator Based on Film Thermoelectric Materials Fabricated by Electrodeposition Technology, Surface & Coatings Technology , 2013, 231:583–589

[21] Synthesis and Characterization of CNTs/Bi2Te3 Thermoelectric Nanocomposites. Int. J. Electrochem. Sci., 2013, (8): 6686 – 6691

[22] Electrodeposition of MWNT/Bi2Te3 Composite Thermoelectric Films. Journal of Elec Materi, 2013, 42:1936-1945

[23] Effect of MWNTs on the Electrochemical Reduction Processes of Bi3+, HTeO2+, and Their Mixtures. Journal of Elec Materi, 2013, 42:2073-2083

[24] Microstructure and Thermoelectric Properties of p-type Bi – Sb-Te Thin Films Prepared by Electrodeposition Method. Thin Solid Films, 2012, 520(7): 2474-2478

[25] Investigation on the Cu(II) and Co(II) Electrochemical Reduction Process in Citrate Solution by CV and EIS. Journal of The Electrochemical Society, 2012, 159 (6): D375-D381

[26] Electrodeposition of p-type BixSb2-xTey Thermoelectric Film from Dimethyl Sulfoxide Solution. Electrochimica Acta, 2010, 55(17): 5000-5005

[27] Electrodeposition of BixSb2-xTey Thermoelectric Films from DMSO Solution. Journal of Electronic Materials, 2010, 39(9): 1562-1565

[28] Studies on the Electrochemical Reduction Processes of HTeO2+ by CV and EIS. Journal of Applied Electrochemistry, 2010, 40(11): 2005-2012

[29] Effect of Substrate on the Structure and Thermoelectric Properties of n-Type Bi2Te3_ySey Thin Films Prepared by Electrodeposition. Journal of Eelectric Materials, 2010, 39(9):1469-1475

[30] Adsorption Behavior and Related Mechanism of Janus Green B during Copper Via-Filling Process.JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2009, 156(4): D119-D124

[31] Invalidating Mechanism of Bis (3-sulfopropyl) Disulfide (SPS) During Copper Via-filling Process. APPLIED SURFACE SCIENCE, 2009, 255(8): 4389-4392

[32] Investigations on the Invalidated Process and Related Mechanism of PEG During Copper Via-filling Process. APPLIED SURFACE SCIENCE, 2009, 255(7): 3977-3982

[33] Studies of the Electrochemical Reduction Processes of Bi3+, HTeO2+ and Their Mixtures. APPLIED SURFACE SCIENCE, 2009, 255(16):7394-7402

[34] Investigations on the Electrodeposition Behaviors of Bi0.5Sb1.5Te3 Thin Film From Nitric Acid Baths. ELECTROCHIMICA ACTA, 2009, 54(14): 3745-3752

[35] Electrochemical Reduction Process of Sb(III) on Au Electrode Investigated by CV and EIS. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2009, 156(3):D84-D91

[36] Electrodeposition of BixSb2-xTey Thermoelectric Thin Films From Nitric Acid And Hydrochloric Acid Systems. APPLIED SURFACE SCIENCE, 2009, 255(7):4225-4231

[37] Effect of Cl-on the Adsorption-Desorption Behavior of PEG. J. Electrochem. Soc., 2008, 155(4): D263-D269.

[38] Effect of the Substrate on the Electrodeposition of Bi2Te3-ySey Thin Films. Materials Research Bulletin, 2008, 43(7): 1808-1813

[39] Electrodeposition of n-type Bi2Te3-ySey Thermoelectric Thin Films on Stainless Steel and Gold Substrates. APPLIED SURFACE SCIENCE, 2007, 253 (6): 3360-3365

[40] Effect of the Dispersibility of ZrO2 Nanoparticles in Ni-ZrO2 Electroplated Nanocomposite Coatings on the Mechanical Properties of Nanocomposite Coatings. APPLIED SURFACE SCIENCE,2006,252 (10): 3812-3817

[41] A New Type of Low Power Thermoelectric Micro-generator Fabricated by Nanowire Array Thermoelectric Materials. Microelectronic Engineering, 2005, 77(3-4):223-229.

[42] Fabrication and Characterization of Ni-ZrO2 Composite Nano-coatings by Pulse Electrodeposition. Scripta Materialia, 2005, 53:613-618

[43] Electrodeposition of Bismuth Telluride on Gold from Acidic Solutions. BULLETIN OF ELECTROCHEMISTRY, 2005, 21 (10): 471-479

[44] Electrochemically Assembled p-type Bi2Te3 Nanowire Arrays. JOURNAL OF APPLIED PHYSICS, 2004, 96(11):615-618.

[45] XPS, UPS and ESR Studies on the Interfacial Interaction in Ni-ZrO2 Composite Plating ”. Journal of Materials Science, 2000, 35: 1495-1499. 

[46]白金电极上での次亚リン酸ィォンの酸化反应. 表面技術,1995,46(5)62-67。

[47]酸性溶液中における无电解ニッケルめつき皮膜の水素发生举动. 表面技術,1995,46(3):76-77。

四、出版专著

1)张宏祥,王为。电镀工艺学。天津科学技术出版社。2002年6月第一版,第一次印刷。

2)沈品华主编,王为主要编写第一章。现代电镀手册(上册)。机械工业出版社,2010。