SCHOOL OF CHEMICAL ENGINEERING

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教授

陈 旭

现任职称/职务:教授/系主任
通讯地址:天津大学化工学院过程装备与控制工程系
电子邮箱:xchen@tju.edu.cn
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论著专利:

http://scholar.google.com/citations?user=bY4MEZQAAAAJ&hl=en


2016


[1]Xiaohui Chen, Xu Chen*, Study on ratcheting effect of pressurized straight pipe with local wall thinning using finite element analysis. International Journal of Pressure Vessels and Piping 139-140 (2016) 69-76

[2]Yang Tian, Dunji Yu, Zizhen Zhao, Gang Chen and Xu Chen*, Low cycle fatigue and creep–fatigue interaction behaviour of 2.25Cr1MoV steel at elevated temperature Materials at High Temperatures 2016 vol 33 no. 1, 75-84

[3]Yansong Tan, Xin Li, Yunhui Mei, Gang Chen, Xu Chen, Temperature-Dependent Dwell- Fatigue Behavior of Nanosilver Sintered Lap Shear Joint Journal of Electronic Packaging, JUNE 2016,Vol.138 / 021001

[4]Xuyang Yuan, Weiwei Yua, Sichao Fu, Dunji Yu*, Xu Chen, Effect of mean stress and ratcheting strain on the low cycle fatigue behavior of a wrought 316LN stainless steel Materials Science and Engineering: A, Vol. 677, 20 November 2016, Pages 193–202

[5]Junfeng Zhang, Dunji Yu, Zhe Zhang, Gang Chen, Xu Chen, Low Cycle Fatigue of 2.25Cr1Mo Steel with Tensile and Compressed Hold Loading at Elevated Temperature, Materials Science & Engineering A, 667 (2016) 251–260

[6]Xiaohui Chen, Xu Chen, Effect of local wall thinning on ratcheting behavior of pressurized 90° elbow pipe under reversed bending using finite element analysis. Steel and Composite Structures, Vol. 20, No. 4 (2016) 931-950

[7]Sichao Fu, Lei Wang, Gang Chen, Dunji Yu, and Xu Chen, A tension-torsional fatigue testing apparatus for micro-scale components,  Review Scientific Instryments, 87, 015111 (2016)

[8]Xiaohui Chen, Xu Chen, Weiwei Yu, Duomin Li, Ratcheting behavior of pressurized 90° elbow piping subjected to reversed in-plane bending with a combined hardening model, International Journal of Pressure Vessels and Piping, Vol.137, 2016, p28-37   

[9]Dunji Yu, Ke An, Xu Chen, Hongbin Bei ,Phase-specific deformation behavior of a NiAl–Cr(Mo) lamellar composite under thermal and mechanical loads, Journal of Alloys and Compounds, Volume 656, 25 January 2016, Pages 481-490


[10]Gang Chen, Qiang Lin, Shan Chen, Xu Chen, In-plane biaxial ratcheting behavior of PVDF UF membrane, Polymer Testing, 2016, 50 : 41-48.


2015

[1]武欣宇,赵姿贞,陈旭一种2.25Cr1MoV钢加氢反应设备蠕变疲劳寿命设计方法,机械工程学报,2015,51(6): 51-57. 

[2]Xu Chen, Hongsheng Lu, Gang Chen, Xin Wang, A comparison between fracture toughness at different locations of longitudinal submerged arc welded and spiral submerged arc welded joints of API X80 pipeline steels, Engineering Fracture Mechanics 148 (2015) 110–121

[3]Yonghe Yang, Lei Shi, Zhen Xu, Hongsheng Lu, Xu Chen, Xin Wang Fracture toughness of the materials in welded joint of X80 pipeline steel, Engineering Fracture Mechanics, Vol.148, 2015, 337-349

[4]Weifeng Chen, Fei Xue, Yang tian, Dunji Yu, Weiwei Yu, Xu Chen, Effect of thermal aging on the low cycle fatigue behavior of Z3CN20.09M cast duplex stainless steel,Materials Science and Engineering: A, Volume 646, 2015, 263-271

[5]Ting Liang, Xu Chen, Haichao Cheng, Gang Chen, Xiang Ling Thermal aging effect on the ratcheting-fatigue behavior of Z2CND18.12N stainless steel, International Journal of Fatigue, Vol.72, 2015, 19-26      

[6]Gang Chen, Ling-tao Lu, Yun Cui, Rui-si Xing, Hong Gao, Xu Chen Ratcheting and low-cycle fatigue characterizations of extruded AZ31B Mg alloy with and without corrosive environment,International Journal of Fatigue, Vol. 80, 2015,  364-371

[7]YANSONG TAN, XIN LI, GANG CHEN, YUNHUI MEI, and XU CHEN, Three-Dimensional Visualization of the Crack-Growth Behavior of Nano-Silver Joints During Shear Creep, Journal of ELECTRONIC MATERIALS, Vol. 44, No. 2, 2015,761-769

[8]Lilan Gao Hong Gao Xu Chen , (2015),"Recent advances in mechanical properties of anisotropic conductive adhesive film for microelectronic packaging", Soldering & Surface Mount Technology, Vol. 27, pp. 164 - 177

[9]Zizhen Zhao, Xu Chen, Xin Wang, Deformation behavior of woven glass/epoxy composite substrate under thermo-mechanical loading, Materials & Design 82 (2015) 130–135

[10]Huaizeng Liu, Xuan Shi, Xu Chen, Yangyang Liu , Management of life extension for topsides process system of offshore platforms in Chinese Bohai Bay Journal of Loss Prevention in the Process Industries 35 (2015) 357-365 

[11]J. ZHAO, L.-L. GAO, H. GAO, X. YUAN and X. CHEN, Biodegradable behaviour and fatigue life of ZEK100 magnesium alloy in simulated physiological environment. fatigue Fract Engng Mater Struct., 2015, 38(8):904–913

[12]S. Shi, G. Chen and X. Chen, Thermo-mechanical Coupling Properties of Proton Exchange Membrane in Liquid Water, Fuel Cells, 2015 June, 15 (3):472-478

[13]Xiaohui Chen, Xu Chen, Gang Chen, Duomin Li, Ratcheting behavior of pressurized Z2CND18.12N stainless steel pipe under different control modes, Steel and Composite Structures, 2015,18(1): 29-50


2014


[1]Chen, Gang; Cui, Shibo; You, Lin; Li, Yan; Mei, Yun-Hui; Chen, Xu, Experimental study on multi-step creep properties of rat skins, Journal of the Mechanical Behavior of Biomedical Materials, 46 49-58, JUN 2015

[2]Wang, Lei, Shi, Shouwen, Fu, Sichao, Chen, Gang, Chen, Xu*, Evaluation of multiaxial fatigue life prediction criteria for PEEK. Theoretical and Applied Fracture Mechanics, 2014, 73(10): 128-135

[3] Yun-Hui Mei, Jiao-Yuan Lian; Xu Chen, Gang Chen; Xin Li, Guo-Quan Lu, Thermo-Mechanical Reliability of Double-Sided IGBT Assembly Bonded by Sintered Nanosilver IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2014, 14(1):194-202

[4]Chen, Gang; Zhang, Ze-Sheng; Mei, Yun-Hui; Xin Li, Gang Chen, Xu Chen,Applying viscoplastic constitutive models to predict ratcheting behavior of sintered nanosilver lap-shear joint. MECHANICS OF MATERIALS,?MECHANICS OF MATERIALS, 2014,72:61-71

[5]Mei, Yun-Hui; Cao, Yunjiao; Chen, Gang; Xin LI, Guo-Quan Lu, Xu Chen, Characterization and Reliability of Sintered Nanosilver Joints by a Rapid Current-Assisted Method for Power Electronics Packaging. IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY,IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY?14(1): 262-267

[6]Lu, Guo-Quan; Yang, Wen; Mei, Yun-Hui, Xin Li, Gang Chen, Xu Chen, Mechanism of Migration of Sintered Nanosilver at High Temperatures in Dry Air for Electronic Packaging. IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2014,?IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY? 14(1): 311-317

[7]Shouwen Shi, Dan Liu, Dazhi Liu, Patrick Tae, Carrie Y. Gao, Lei Yan, Ke An, Xu Chen, Mechanical Properties and Microstructure Change of Proton Exchange Membrane under Immersed Conditions, Polymer Engineering & Science, 2014, 54 (10), 2215–2221

[8]W. Xu, H Gao*, L Gao, J Ma, X. Chen, Uniaxial timedependent ratcheting behavior of bronze powder filled polytetrafluoroethylene at room and high temperature, Polymer Engineering & Science, 2014, 54: 1571-1578?

[9]D. Yu, K. An, Y. Chen, X. Chen, Revealing the cyclic hardening mechanism of an austenitic stainless steel by real-time in situ neutron diffraction, Scripta Materialia, 2014, 89: 45-48

[10] L. LI, Y. H. YANG, Z. XU, G. CHEN and X. CHEN, Fatigue crack growth law of API X80 pipeline steel under various stress ratios based on J-integral. Fatigue & Fracture of Engineering Materials & StructuresVolume 37, Issue 10, 6 MAY 2014,1124-1137

[11]Ting Liang, Yongfeng Liang, Jiaye Fang, Gang Chen, Xu Chen, Torsional fatigue with axial constant stress for Sn-3Ag-0.5Cu lead-free solder, International Journal of Fatigue, 2014, 67:203-211

[12]Gang Chen, Lin Yu, Yun-Hui Mei, Xin Li, Xu Chen, Guo-Quan Lu, Reliability comparison between SAC305 joint and sintered nanosilver joint at high temperatures for power electronic packaging. Journal of Materials Processing Technology 214 (2014) 1900–1908


[13]Shancan Fu, YunhuiMei, Guo-Quan Lu, Xin Li, Gang Chen, Xu Chen, Pressureless sintering of nanosilver paste at low temperature to join largearea(>100mm2) power chips for electronic packaging, Materials Letters, 2014, 128:42–45

[14]Sichao Fu, Hong Gao, Gang Chen, Lilan Gao, Xu Chen, Deterioration of mechanical proserties for pre-corroded AZ31 sheet in simulated phsiological environment, Materials Science & Engineering A, 2014,593:153-162

[15]Gang Chen, Lin Yu, Yunhui Mei, Xin Li, Xu Chen, Guo-Quan LuUniaxial ratcheting behavior of sintered nanosilver joint for electronic packaging, Materials Science & Engineering A, 2014, Vol.591: 121-129



2013
[1] Dunji Yu, Ke An, Carrie Y. Gao, William T. Heller, and Xu Chen, A portable hydro-thermo-mechanical loading cell for in situ small angle neutron scattering studies of proton exchange membranes, Review of Scientific Instruments, 2013, 84, 105115
[2]Yi Yan, Youliang Guan, Xu Chen, Guo-Quan Lu,Effects of voids in Sintered Silver Joint on Thermal and Optoelectronic Performances of High Power Laser Diode, Journal of Electronic Packaging, 2013, Vol. 135, 041003
[3]Y Mei, G Chen, Y Cao, X Li, D Han, X Chen, Simplification of Low-Temperature Sintering Nanosilver for Power Electronics Packaging, Journal of Electronic Materials, 2013, 42(6): 1209-1218
[4] GChen, ZSZhang, YHMei, XLi, GQLu, X Chen. Ratcheting Behavior of Sandwiched Assembly Joined by Sintered Nanosilver for Power Electronics Packaging. Microelectronics Reliability. 2013, 53:645–651
[5]Hua Li, Mingjian Wen, Gang Chen, Weiwei Yu, Xu Chen, Constitutive modeling for the anisotropic uniaxial ratcheting behavior of Zircaloy-4 alloy at room temperature, Journal of Nuclear Materials, 2013, 443(1–3): 152-160
[6]Xin Li, Gang Chen, Lei Wang, Yun-Hui Mei, Xu Chen, Guo-Quan Lu, Creep properties of low-temperature sintered nano-silver lap shear joints. Materials Science & Engineering A, 2013, 579:108–113
[7]Yong Wang, Dunji Yu, Gang Chen, Xu Chen, Effects of pre-strain on uniaxial ratcheting and fatigue failure of Z2CN18.10 austenitic stainless steel, International Journal of Fatigue, 2013, 52 : 106–113
[8]Shouwen Shi, Gang Chen, Zhenfeng Wang, Xu Chen, Mechanical properties of Nafion 212 proton exchange membrane subjected to hygrothermal aging,Journal of Power Sources, 2013, 238: 318–323
[9]Yunhui Mei, Yunjiao Cao, Gang Chen, Xin Li, Guo-Quan Lu, Xu Chen, Rapid Sintering Nanosilver Joint by Pulse Current for Power Electronics Packaging. IEEE Transactions on Device and Materials Reliability, 2013, 13 (1):258-265. 
[10]Hongrui Shi, Gang Chen, Yong Wang, Xu Chen, Ratcheting behavior of pressurized elbow pipe with local wall thinning, International Journal of Pressure Vessels and Piping, 2013, Vol.102, 14-23
[11]Xin Li, Gang Chen, Xu Chen, Guo-Quan Lu, Lei Wang, Yun-Hui Mei, High temperature ratcheting behavior of nano-silver paste sintered lap shear joint under cyclic shear force,Microelectronics Reliability,2013, 53(1): 174-181
[12]Yunhui Mei, GangChen, XinLi, Guo-QuanLu,Xu Chen,Evolution of Curvature under Thermal-Cycling in Sandwich Assembly Bonded by Sintered Nano-silver Paste" Soldering & Surface Mount Technology, 2013, Vol.25, No.2, 107-116
[13]Yunhui Mei, Gang Chen,Yunjiao Cao, Xin Li, Dan Han, and Xu Chen, Simplification of Low-Temperature Sintering Nanosilver for Power Electronics Packaging,  Journal of Electronic Materials, 2013, Vol. 42, No. 6, 1209-1218
[14]Xiaohui Chen,Xu Chen, Dunji Yu, Binjun Gao, Recent progresses in experimental investigation and finite element analysis of ratcheting in pressurized piping, International Journal of Pressure Vessels and Piping, 2013, 101:113-142
[15]Mingjian Wen, Hua Li, Dunji Yu, Gang Chen, Xu Chen, Uniaxial ratcheting behavior of Zircaloy-4 tubes at room temperature, Materials and Design, 2013, 46:426-434

2012
[1]Gang Chen, Yunjiao Cao, Yunhui Mei, Dan Han, Guo-Quan Lu, Xu Chen, Pressure-Assisted Low-Temperature Sintering of Nanosilver Paste for 5 × 5mm2 Chip Attachment, IEEE Transactions on Components, Packaging and Manufacturing Technology, 2012, Vol.2, No.11, 1759-1767
[2]Dunji Yu, Weiwei Yu, Gang Chen, Fengmin Jing, Xu Chen, Role of dynamic strain aging in the tensile property, cyclic deformation and fatigue behavior of Z2CND18.12N stainless steel between 293K and 723K, Materials Science & Engineering A, 2012, 558: 730-736
[3]Yi Yan, Xu Chen, Xingsheng Liu, Yunhui Mei, Guo-Quan Lu,Die Bonding of High Power 808nm Laser Diodes with Nano-Silver Paste, ASME Transaction on Journal of Electronic Packaging, 2012, 134,041003
[4]Yunhui Mei, Tao Wang, Xiao Cao, Gang Chen, Guo-Quan Lu, and Xu Chen, Transient Thermal Impedance Measurementson Low-Temperature-Sintered Nanoscale Silver Joints, Journal Electronic Materials, 2012, Vol. 41, No. 11, 3152-3160
[5]Yue Cui, Hong Gao, Jinsheng Sun, Yanhong Wang, Xu Chen, Shuo Jiang, Numerical simulation of gas–solid flow in a conveying vessel, Powder Technology 226 (2012) 34–42
[6]Tao Wang, Meihua Zhao,Xu Chen, Guo-Quan Lu, Khan Ngo, and Shufang Luo, Shrinkage and Sintering Behavior of a Low-Temperature Sinterable Nanosilver Die-Attach Paste, Journal Electronic Materials, 2012, 41(9):2543-2552
[7]Dunji Yu, Xu Chen, Weiwei Yu, Gang Chen,Thermo-viscoplastic modeling incorporating dynamic strain aging effect on the uniaxial behavior of Z2CND18.12N stainless steel, International Journal of Plasticity, 2012, 37:119-139
[8]Shouwen Shi, Dunji Yu, Lilan gao, Gang Chen, Jian Chen, Xu Chen, Nonlinear Viscoelastic-plastic Constitutive Description of Proton Exchange Membrane under Immersed Condition, Journal of Power Sources, 2012, 213: 40-46
[9] Li-Lan Gao, Xu Chen, Hong Gao, Mechanical Properties of Anisotropic Conductive Adhesive Film Under Hygrothermal Aging and Thermal Cycling,Journal Electronic Materials, 2012, Vol.41, No.7, 2001-2009
[10]Yunhui Mei, GangChen, Guo-QuanLu, XuChen,Effect of joint sizes of low-temperature sintered nano-silver on thermal residual curvature of sandwiched assembly, International Journal of Adhesion and Adhesives, 2012, 35: 88-93
[11]Gang Chen, Xiu-Hu Sun, Peng Nie, Yun-Hui Mei, Guo-Quan Lu, and Xu Chen, High-Temperature Creep Behavior of Low-Temperature-Sintered Nano-Silver Paste Films, Journal of Electronic material, 2012, 41(4):782-790
[12]Gang Chen, D Han, YH Mei, X Cao, T Wang, X Chen, GQ LuTransient Thermal Performance of IGBT Power Modules attached by Low-Temperature Sintered Nano-Silver, Device and Materials Reliability, IEEE Transactions on, 2012, 12(1):124-132
[13]Chao Li, Gang Chen, Xu Chen, Weihua Zhang, Ratcheting strain and simulation of 16MnR steel under uniaxial cyclic loading,Computation material Science,2012,57: 43-47
[14]X Li, G Chen, X Chen, GQ Lu, L Wang, Y Mei,Mechanical Property Evaluation of Nano-Silver Paste Sintered Joint Using Lap-Shear Test, Soldering & Surface Mount Technology 2012, 24 (2), 120-126 
[15]Dunji Yu, Gang Chen, Weiwei Yu, Duomin Li, Xu Chen, Visco-plastic constitutive modeling on Ohno-Wang kinematic hardening rule for uniaxial ratcheting behavior of Z2CND18.12N steel, Int. J. Plasticity, 2012, Vol.28, No,1, 88-101
[16]JianBei Zhu, Xu Chen, Fei Xue, Weiwei Yu, Bending Ratcheting Tests of Z2CND18.12 stainless steel, International Journal of Fatigue, 2012, Vol.35, No.1, 16-22
[17]Lilan Gao, Xu Chen, Hong Gao, Shear strength Behavior of Anisotropic Conductive Adhesive Joints under Hygrothermal Aging and Thermal Cycling, Int. J. Adhesives &Adhesion, 2012, Vol.33, pp75-79


2011

[1]Yunhui Mei, Guo-Quan Lu, Xu Chen, Gang ChenandShufang Luo,Investigation of Post-Etch Copper Residue on Direct Bonded Copper (DBC) Substrates, Journal of Electronic Materials, 2011, Vol.40, No.10, 2119-2125.
[2]Liubing Wang, Dunji Yu, Fei Xue, Weiwei Yu, Jian Chen,Xu Chen, Fatigue behaviors of Z2CND18.12N stainless steel under thermal- mechanical cycling, Acta Metall. Sinica.(Engl. Lett.) 2011, Vol.24 No.2 pp 101-108
[3]Lilan Gao, Lei Wang, Hong Gao, Gang Chen, Xu Chen, Fatigue life evaluation of anisotropic conductive adhesive film joints under mechanical and hygrothermal loads,Microelectronics Reliability, 2011, Vol.51, No.8, 1393-1397
[4]Yanping Wang, Xu Chen,Weiwei Yu, Microscopic mechanism of multiaxial fatigue of vulcanized natural rubber, Plastic, Rubber & Composites, 2011, Vol.40, No.10, 491-496
[5]Yunhui Mei, Guo-Quan Lu, Xu Chen, Shufang Luo, Dimeji Ibitayo, and Bruce Geil, Electromigration of Sintered Nanosilver Die-attach Material on Alumina Substrate Between 250oC and 400 oC  in Dry Air, IEEE Transactions on Device and Materials Reliability, 2011, 11 (2): 316-323.
[6] Yunhui Mei, Guo-Quan Lu,Xu Chen, Shufang Luo, Dimeji Ibitayo, Effect of Oxygen Partial Pressure on Silver Migration of Low-Temperature Sintered Nanosilver Die-Attach Material. IEEE Transactions on Device and Materials Reliability, 2011, 11 (2): 312-315 
[7]Xu Chen, Lei Yan, Zhenfeng Wang, Dan Liu, Out-of-phase thermo-mechanical coupling behavior of proton exchange membranes, Journal of Power Sources,196 (2011) 2644–2649


2010

[1]P Panaccione, Tao Wang, Xu Chen, Luo Susan, GQ Lu, Improved Heat Dissipation and Optical Performance of High-Power LED Packaging with Sintered Nanosilver Die-Attach Material,Journal of microelectronics and electronic packaging 7 (3), 164-168
[2] Xin Li, Xu Chen, Guo-Quan Lu, Reliability of High-Power LightEmitting Diode Attached WithDifferent Thermal InterfaceMaterials, ASME Trans. Journal of Electronic Packaging, 2010, Vol.132, No.3, 031011 
[3]Xinjian Zhang, Lu Huang, Xu Chen, Peter K. Liaw,Ke An,and Tao Zhang, Gongyao Wang, Mechanical Behavior of Fe75Mo5P10C7.5B2.5Bulk-Metallic Glass under Torsional Loading, Materials Science and Engineering A, 2010, 527: 7801-7807
[4]Tao Wang, Gang Chen, Yanping Wang, Xu Chen, Guo-quan Lu,Uniaxial ratcheting and fatigue behaviors of low-temperature sintered nano-scale silver paste at room and high temperatures, Materials Science and Engineering A, 2010,527: 6714–6722
[5] LLGao, XChen, HGao, SB.Zhang,Description of nonlinear viscoelastic behavior and creep-rupture time of anisotropic conductive film,Materials Science and Engineering A 2010, A 527: 5115–5121.
[6]Guangcheng Dong, Xu Chen, Xinjian Zhang, Khai D.T. Ngo, Guo-Quan Lu, Thermal fatigue behaviour of Al2O3-DBC substrates under high temperature cyclic loading,Soldering & Surface Mount Technology,2010, Vol.22,No.2, pp. 43-48
[7]Thomas Guangyin Lei, Jesus Noel Calata, Guo-Quan Lu, Xu Chen, and Shufang Luo, Low-Temperature Sintering of Nanoscale Silver Paste for Attaching Large-Area (>100mm2) Chips. IEEE Transactions on Components and Packaging Technology, 2010, Vol.33, No.1, pp98-104
[8]Zhe Zhang, Xu Chen*,Yanping Wang,Uniaxial ratcheting behavior of PTFE materials at elevated temperature, Polymer Testing, 2010, 29: 352-357
[9]Youliang Guan, Xu Chen, Fengqin Li, Hong Gao,Study on the Curing Process and Shearing Tests of Die Attachment by Ag-epoxy Electrically Conductive Adhesive, International Journal of Adhesion and Adhesives, 2010,30:80-88

2009
[1]Yunhui Mei, Xu Chen, and Hong Gao,Hygrothermal Effects on the Tensile Properties of Anisotropic Conductive Films, Journal of Electronic Materials, 2009, Vol.38, No.11, 2415-2426
[2]Gang Chen, Shan Shicao, Xu Chen, Huang Yuan, Ratcheting and fatigue properties of the high-nitrogen steel X13CrMnMoN18-14-3 under cyclic loading, Computational Materials Science, 2009, Vol.46, 572-578
[3]Dunji Yu, Xu Chen, Gang Chen, Guo-quan Lu, Zheng-qiang Wang, Applying Anand model to low-temperature sintered nanoscale silver paste chip attachment, Materials and Design, 2009, 30:4574-4579
[4]Ning Bai, Xu Chen, A new unified constitutive model with short and long range back stress for lead-free solders of Sn-3Ag-0.5Cu and Sn-0.7Cu. International Journal of Plasticity, 2009, 25(11): 2181-2203 
[5]Li-Lan Gao, Xu Chen,Shu-Bao Zhang, Hong Gao,Mechanical Properties of Anisotropic Conductive Film with Strain Rate and Temperature, Materials Science and Engineering A:2009, 513-514, 216-221
[6]Guangcheng Dong, ThomasLei, Xu Chen,Khai Ngo, Guo-Quan Lu, Edge tail length effect on reliability of DBC substrate under thermal cycles, Soldering & Surface Mount Technology, 2009, Vol.21, No.3, 10-15
[7] Zhe Zhang, Xu Chen, Multiaxial ratcheting behavior of PTFE at room temperature. Polymer testing, 2009,28(3)pp. 288-295
[8]Kwang S. Kim, Rong Jiao, Xu Chen, and Masao Sakane, Ratcheting of Stainless Steel 304 Under Multiaxial Nonproportional Loading. ASME Trans. J. Pressure Vessel Technol. 131, No.2, 021405 (2009)
[9]Yangping Wang, Xu Chen, Weiwei Yu, Lei Yan,  Experimental study on multiaxial ratchetting behavior of vulcanized natural rubber, Polymer Engineering and Science, 2009, Vol.49, No.3, p.506-513
[10] Hong Gao, Xu Chen, Effect of axial ratcheting deformation on torsional low cycle fatigue life of lead-free solder Sn-3.5Ag, International Journal of Fatigue, 2009, Vol.31,No.2, p276-283
[11]Bai Ning, Xu Chen, Hong Gao, Simulation of uniaxial tensile properties for lead-free solders with modified Anand model,Materials and Design, 2009, 30:122-128

授权专利:
[1]陈旭,陈刚,于德华,高频响应高温拉-扭疲劳引伸计,发明专利200410072189.1,授权日2006年8月25日
[2] 陈旭,张军,加速温度循环试验台,发明专利ZL200410072233.9, 授权日2006年5月17日
[3] 陈旭,陈刚,微型宽频拉-扭疲劳试验机,实用新型专利ZL200420029811.6,授权日2005年9月28日
[4]陈旭,陆国权,宋洁,以纳米银焊膏低温烧结封装连接大功率LED的方法,发明专利ZL200610014157.5,授权日:2008.11.19
[5]陈旭,梅云辉,陈刚,高柄军,,余伟炜,薛飞,直管多轴棘轮应变测试系统及方法,发明专利ZL201010600661.X,2010年12月22日
[6] 陈旭,梅云辉,陈刚,高柄军,余伟炜,薛飞,管道弯头多轴棘轮应变测试系统及方法,发明专利ZL201010599442.4,2010年12月22日,授权日:2013年2月6日
[7]高红,马健,陈旭,各向异性导电胶膜用复合导电粒子及制备方法, 发明专利ZL2011100019080。
[8]陈旭,王涛,陆国权,纳米银焊膏封装大功率白光发光二极管LED模块及其封装方法,发明专利ZL201210097379.3