陈 刚



[1] Wang XJ, Xu DK, Wu RZ, Chen XB, Peng QM, Jin L, Xin YC, Zhang ZQ, Liu Y, Chen XH, Chen G, Deng KK, Wang HY ( All authors contribute equally to this work). What is going on in magnesium alloysJournal of Materials Science & Technology, 2017; In press. (/) IF: 2.764
[2] Chen G, Ren JN, Gao H, Cui Y, Chen X. Pseudoelastic and corrosion behaviors of Mg ZEK100 alloy under cyclic loading. International Journal of Fatigue, 2017; 103: 466-477. (/) IF: 2.899 
[3] Lin Q, Shi SW, Wang L, Chen S, Chen X, Chen G*. In-plane Biaxial Cyclic Mechanical Behavior of Proton Exchange Membranes. Journal of Power Sources, 2017; 360: 495-503. (/) IF: 6.333
[4] Chen G*, Zhao XC, Wu H. A critical review of constitutive models for solders in electronic packaging. Advances in Mechanical Engineering, 2017; 9(8): 1-21. IF: 0.827
[5] Chen G*, Xu C, Qu H, Chen X. Ratcheting behavior of zirconium alloy tubes under combined cyclic axial load and internal pressure at 350 °C, Journal of Nuclear Materials, 2017; 491: 138-148. (/) IF: 2.048. 
[6] Chen G, Zhang X, Xu DK, Li DH, Chen X, Zhang Z*, Multiaxial ratcheting behavior of zirconium alloy tubes under combined cyclic axial load and internal pressure, Journal of Nuclear Materials, 2017; 489: 99-108. (/) IF: 2.048.
[7] Chen G, Wu H, Gao JW, Lin Q*, Development of high-frequency and large-stroke fatigue testing system for rubber, Review of Scientific Instruments, 2017; 88(4): 045113. (/) IF: 1.336. 
[8] Shi LT, Mei YH, Chen G*, Chen X. In Situ X-Ray Observation and Simulation of Ratcheting-Fatigue Interactions in Solder Joints, Electronic Materials Letters, 2017; 13(1): 97-106. (/) IF: 2.057. 
[9] Chen G*, Zhang Y, Xu DK, Lin YC, Chen X, Low Cycle Fatigue and Creep-Fatigue Interaction Behavior of Nickel-Base Superalloy GH4169 at Elevated Temperature of 650 oC, Materials Science & Engineering A. 2016; 655: 175-182. (/) IF: 2.647 
[10] Chen G*, Lin Q, Chen S, Chen X, In-plane biaxial ratcheting behavior of PVDF UF membrane, Polymer Testing, 2016; 50: 41-48. (/) IF: 2.35 
[11] Chen G*, Lu LT, Cui Y, Xing RS, Gao H, Chen X, Ratcheting and fatigue characterizations for extruded AZ31B Mg alloy with and without corrosion environment, International Journal of Fatigue, 2015; 80: 364-371. (/) IF: 2.899 
[12] Chen G, Cui SB, You L, Li Y, Mei YH*, Chen X, Experimental study on multi-step creep properties of rat skins, Journal of the Mechanical Behavior of Biomedical Materials. 2015; 46: 49-58. (/) IF: 2.876 
[13] Liang T, Chen X, Cheng HC, Chen G*, Ling X, Thermal aging effect on the ratcheting-fatigue behavior of Z2CND18.12N stainless steel. International Journal of Fatigue, 2015; 72: 19-26. (/) IF: 2.162 
[14] Chen G, Liang HQ, Wang L, Mei YH*, Chen X. Multiaxial ratcheting-fatigue interaction on acrylonitrile-butadiene-styrene terpolymer (ABS). Polymer Engineering and Science. 2015; 55 (3): 664-671. (/) IF: 1.719 
[15] Wang L, Chen G*, Zhu JB, Sun XH, Mei YH, Chen X, Bending ratcheting behavior of pressurized straight Z2CND18.12N stainless steel pipe. Structural Engineering and Mechanics, An International Journal. 2014; 52 (6): 1135-1156. (/) IF: 1.021
[16] Chen G, Zhang ZS, Mei YH*, Li X, Yu DJ, Wang L, Chen X. Applying Viscoplastic Constitutive Models to Predict Ratcheting Behavior of Sintered Nanosilver Lap-Shear Joint. Mechanics of Materials. 2014; 72: 61-71. (/) IF: 2.636 
[17] Chen G, Yu L, Mei YH*, Li X, Chen X, Lu GQ. Reliability Comparison between SAC305 Joint and Sintered Nanosilver Joint at High Temperatures for Power Electronic Packaging. Journal of Materials Processing Technology. 2014; 214(9): 1900-1908. (/) IF: 2.359 
[18] Fu SC, Gao H, Chen G*, Gao LL, Chen X. Deterioration of mechanical properties for pre-corroded AZ31 sheet in simulated physiological environment. Materials Science & Engineering A. 2014; 593: 153-162. (/)
[19] Chen G, Yu L, Mei YH*, Li X, Lu GQ, Chen X. Uniaxial Ratcheting Behavior of Sintered Nanosilver Joint for Electronic Packaging. Materials Science & Engineering A. 2014; 591: 121-129. (/)
[20] Mei YH, Cao YJ, Chen G*, Li X, Lu GQ, Chen X. Characterization and Reliability of Sinter Nanosilver Joints by A Rapid Current-Assisted Method for Power Electronics Packaging. IEEE Transactions on Device and Materials Reliability. 2014; 14(1): 262-267. (/) IF: 1.437 
[21] Li X, Chen G*, Wang L, Mei YH, Chen X, Lu GQ. Creep Properties of Low-Temperature Sintered Nano-Silver Lap Shear Joints. Materials Science & Engineering A. 2013; 579: 108-113. (/)
[22] Mei YH, Chen G*, Cao YJ, Li X, Han D, Chen X. Simplification of Low-Temperature Sintering Nanosilver for Power Electronics Packaging. Journal of Electronic Materials, 2013; 42(6): 1209-1218. (/) IF: 1.491 
[23] Mei YH, Cao YJ, Chen G*, Li X, Lu GQ, Chen X. Rapid Sintering Nanosilver Joint by Pulse-Current for Power Electronics Packaging. IEEE Transactions on Device and Materials Reliability. 2013;13(1): 258-265. (/)
[24] Chen G, Zhang ZS, Mei YH*, Li X, Lu GQ, Chen X. Ratcheting Behavior of Sandwiched Assembly Joined by Sintered Nanosilver for Power Electronics Packaging. Microelectronics Reliability. 2013; 53(4): 645-651. (/) IF: 1.202 
[25] Mei YH, Chen G*, Li X, Lu GQ, Chen X. Evolution of Curvature under Thermal Cycling in Sandwich Assembly Bonded by Sintered Nano-silver Paste, Soldering & Surface Mount Technology. 2013; 25(2): 107-116. (/) IF: 0.913
[26] Wen MJ, Li H, Yu DJ, Chen G*, Chen X. Uniaxial ratcheting behavior of Zircaloy-4 tubes at room temperature. Materials & Design. 2013; 46, 426-434. (/) IF: 3.997 
[27] Li X, Chen G*, Chen X, Lu GQ, Wang L, Mei YH. High temperature ratcheting behavior of nano-silver paste sintered lap shear joint under cyclic shear force. Microelectronics Reliability. 2013; 53(1): 174-181. (/)
[28] Mei YH, Wang T, Cao X, Chen G*, Lu GQ, Chen X. Transient Thermal Impedance Measurement on Low-Temperature Sintered Nano-silver Joints. Journal of Electronic Materials. 2012; 41 (11) : 3152-3160. (/)
[29] Chen G, Cao YJ, Mei YH*, Han D, Li X, Lu GQ, Chen X. Pressures-Assisted Low-Temperature Sintering of Nanosilver Paste for 5×5 mm2 Chip Attachment, IEEE Transactions on Components and Packaging Technology. 2012; 2 (11): 1759-1767. (/) IF: 1.151 
[30] Li X, Chen G*, Chen X, Lu GQ, Wang L, Mei YH. Mechanical Property Evaluation of Nano-Silver Paste Sintered Joint Using Lap-Shear Test. Soldering & Surface Mount Technology. 2012; 24:120-6. (/)
[31] Chen G, Sun XH, Nie P, Mei YH*, Lu GQ, Chen X. High-Temperature Creep Behavior of Low-Temperature-Sintered Nano-Silver Paste Films. Journal of Electronic Materials. 2012; 41:782-90. (/)
[32] Chen G, Han D, Mei YH*, Cao X, Wang T, Chen X, et al. Transient Thermal Performance of IGBT Power Modules attached by Low-Temperature Sintered Nano-Silver., IEEE Transactions on Device and Materials Reliability. 2012; 12(1): 124-32. (/)
[33] Chen G, Shan SC, Chen X*, Yuan H. Ratcheting and fatigue properties of the high-nitrogen steel X13CrMnMoN18-14-3 under cyclic loading. Computational Materials Science. 2009; 46: 572-8. (/) IF: 2.086 
[34] Chen G, Chen X*, Kim KS, Abdel-Karim M, Sakane M. Strain rate dependent constitutive model of multiaxial ratchetting of 63Sn–37Pb solder. ASME Transaction on Journal of Electronic Packaging. 2007; 129: 278. (/) IF: 1.402 
[35] Chen G, Chen X*. Fatigue damage coupled constitutive model for 63Sn37Pb solder under proportional and non-proportional loading. Mechanics of materials. 2007; 39:11-23. (/)
[36] Chen G, Chen X*, Niu CD. Uniaxial ratcheting behavior of 63Sn37Pb solder with loading histories and stress rates. Materials Science & Engineering: A. 2006; 421: 238-44. (/)
[37] Chen G, Chen X*. Constitutive and damage model for 63Sn37Pb solder under uniaxial and torsional cyclic loading. International journal of solids and structures. 2006;43:3596-612. (/) IF: 2.081 
[38] Chen G, Chen X*. Finite element analysis of fleXBGA reliability. Soldering & Surface Mount Technology. 2006; 18(2): 46-53. (/) 
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